Kanthi paningkatan permintaan pasar, luwih akeh jinis target sputtering terus dianyari.Ana sing kenal lan ana sing ora kenal karo pelanggan.Saiki, kita pengin nuduhake karo sampeyan apa jinis target sputtering magnetron.
Target sputtering duwe jinis ing ngisor iki: target lapisan sputtering logam, target lapisan sputtering alloy, target lapisan sputtering keramik, target sputtering keramik boride, target sputtering keramik karbida, target sputtering keramik fluoride, target sputtering keramik nitrida, target keramik sputtering, selenide ceramic target , target sputtering keramik silicide, target sputtering keramik sulfida, target sputtering keramik telluride, target keramik liyane, Target keramik silikon oksida kromium (CR SiO), target indium phosphide (INP), target arsenide timbal (pbas), target indium arsenide (InAs ).
Magnetron sputtering umume dipérang dadi rong jinis: DC sputtering lan RF sputtering.Prinsip peralatan DC sputtering prasaja, lan tingkat uga cepet nalika sputtering logam.RF sputtering digunakake akeh.Saliyane sputtering data konduktif, uga bisa sputter data non-konduktif.Ing wektu sing padha, target sputtering uga nindakake sputtering reaktif kanggo nyiapake data senyawa kayata oksida, nitrida lan karbida.Yen frekuensi RF mundhak, bakal dadi sputtering plasma gelombang mikro.Saiki, sputtering plasma gelombang mikro elektron cyclotron resonance (ECR) umume digunakake.
Wektu kirim: Mei-18-2022